▎ 摘　　要

NOVELTY - A polymer composition comprises a liquid crystalline polymer, an electroconductive filler, and a mineral filler, and has a surface resistivity of 1x1012 (Ohm) to 1x1016 (Ohm) as determined in accordance with ASTM D257-14. USE - Polymer composition is used for forming substrate e.g. molded interconnect device for electronic device (all claimed) e.g. packaged electronic device. Uses include but are not limited to printed circuit board, flex circuit, connector, thermal management feature, high current conductor, radio-frequency identification apparatus, antenna, wireless power device, sensor, LED device, microprocessor, memory device, passive device, impedance control device, electromechanical apparatus, etc. ADVANTAGE - The polymer composition is free of spinel crystals, and provides substrate having improved mechanical property, such as strength, and heat resistance, and desired surface resistivity and volume resistivity. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: (1) substrate (42), which comprises the polymer composition, and conductive circuit traces arranged on a surface of the substrate; and (2) electronic device, which comprises the substrate which is molded into a singulated carrier portion. DESCRIPTION OF DRAWING(S) - The drawing shows a flow diagram of manufacture of the electronic device. Substrate (42) Seed layer (44) Electrical component (50) Carrier hole (52) Lead frame (54)