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  • 专利标题:   High thermal conductivity high frequency flexible copper clad laminate for flexible printing circuit board, has adhesive layer obtained by drying glue, where glue comprises e.g. inorganic filler, rubber, resin, curing agent, and dispersant.
  • 专利号:   CN114434911-A
  • 发明人:   WANG Q, ZHANG B, WU T, GENG J, ZHUO F, GENG G, WU Y
  • 专利权人:   SHANDONG JINDING ELECTRONIC MATERIAL CO
  • 国际专利分类:   B32B015/08, B32B015/20, B32B027/28, B32B037/10, B32B037/12, B32B007/12, C09J011/04, C09J121/00, C09J179/04, C09J007/25, C09J007/30
  • 专利详细信息:   CN114434911-A 06 May 2022 B32B-027/28 202263 Chinese
  • 申请详细信息:   CN114434911-A CN10040045 13 Jan 2022
  • 优先权号:   layer (1), Copper foil layer (2), Adhesive layer (3)CN10040045

▎ 摘　　要

NOVELTY - High thermal conductivity high frequency flexible copper clad laminate comprises an adhesive layer, where the adhesive layer is obtained by drying glue. Each 100 pts. wt. glue comprises 20-35 pts. wt., preferably 27 pts. wt. inorganic filler, 25-35 pts. wt., preferably 35 pts. wt. rubber, 20-35 pts. wt., preferably 32 pts. wt. resin, curing agent, metal ion scavenger, catalyst and dispersant. The particle size of the inorganic filler is 3-6 mum. USE - The laminate is useful for flexible printing circuit board. ADVANTAGE - The laminate has good high heat conduction and low magnetic loss performance, can meet the requirement of fast transmission of communication signal, and has high quality stability. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparing high thermal conductivity and high frequency flexible copper clad laminate. DESCRIPTION OF DRAWING(S) - The drawing shows a flexible copper-clad laminate structure.