▎ 摘　　要

NOVELTY - The utility model claims a deep UV-LED packaging structure, comprising a substrate, a deep ultraviolet LED chip, a heat conducting filler, a first die bonding layer, a second die bonding layer, a first metal interconnect layer, a second metal interconnect layer, a third metal interconnect layer, cover plate cover plate, and a reflective layer; wherein the reflecting layer is located at the side of the deep ultraviolet chip LED the ultraviolet light of the deep ultraviolet chip LED reflected to the front of the deep ultraviolet chip LED the reflecting layer. The utility model solves the radiation failure problem of the packaging glue by the deep ultraviolet light, so as to improve the reliability of the packaging structure; The reflecting layer used by the utility model is capable of improving the light emitting rate, on the other hand, it can reduce the damage of the ultraviolet light to the sealing filler; The reducing and graphene silicon rubber used in the utility model can greatly improve the radiating ability of the deep ultraviolet LED chip; at the same time, it solves the problem that agglomerant is easy to be damaged by deep ultraviolet. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for the packaging structure of deep UV LED to claim.