• 专利标题:   Heat-dissipating plastic used for e.g. electronic component, comprises polymer matrix including main resin, and carbon-based filler including fibrous carbon-based filler and granular carbon-based filler, dispersed in polymer matrix.
  • 专利号:   WO2021034144-A1, KR2021023755-A, CN114271040-A, KR2425103-B1, US2022267659-A1
  • 发明人:   LEE J H, LI Z
  • 专利权人:   AMOGREENTECH CO LTD, AMOGREENTECH CO LTD
  • 国际专利分类:   C08J005/04, C08J005/10, C08K003/04, C08K007/06, F21V029/85, F21V029/87, H05K007/20, C09K005/14
  • 专利详细信息:   WO2021034144-A1 25 Feb 2021 202122 Pages: 26
  • 申请详细信息:   WO2021034144-A1 WOKR011172 21 Aug 2020
  • 优先权号:   KR102091, CN80059048

▎ 摘  要

NOVELTY - A heat-dissipating plastic (100) comprises a polymer matrix (10) including a main resin, and a carbon-based filler including a fibrous carbon-based filler (20) and a granular carbon-based filler (30), dispersed in the polymer matrix. USE - Heat-dissipating plastic. Uses include but are not limited to electronic component, lights, converter housing, and other devices. ADVANTAGE - The heat-dissipating plastic has high thermal conductivity, excellent mechanical strength even when having excellent heat-dissipation characteristics, and less generation of cracks. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of the heat-dissipating plastic. Polymer matrix (10) Fibrous carbon-based filler (20) Granular carbon-based filler (30) Heat-dissipating plastic (100)