▎ 摘　　要

NOVELTY - The component comprises a plate-like aluminum nitride sintered body having a placement surface on which a substrate is to be placed. The aluminum nitride sintered body contains carbon, and the thermal conductivity of the aluminum nitride sintered body in an in-plane direction along the placement surface is higher than that of the aluminum nitride sintered body in a thickness direction. The carbon is in the form of graphene, and the graphene is oriented in the in-plane direction of the aluminum nitride sintered body. An electrode is embedded in the aluminum nitride sintered body. Multiple electrodes are embedded in the aluminum nitride sintered body such that the electrodes are separated from each other in the thickness direction and overlap each other as viewed in the thickness direction. USE - Semiconductor manufacturing equipment component (Claimed). ADVANTAGE - The component achieves a uniform temperature distribution as compared with conventional ones. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a method for producing a semiconductor manufacturing equipment component. DESCRIPTION OF DRAWING(S) - The drawing shows an explanatory view of a semiconductor manufacturing equipment component. Semiconductor Manufacturing Equipment Component (1) Aluminum Nitride Sintered Body (2) Cylindrical Shaft (3) Electrode (4) Sample (5)