▎ 摘　　要

NOVELTY - Low-fold thermal conductive graphene film comprises high-tenacity graphene film with 2-2.2 g/cm3 density and 50 mu m planar graphene sheets with pi pi conjugation, 50-300 mm/mm2 wrinkle density and less than 0.01 ID/TG. USE - Low-fold thermal conductive graphene film used as high flexible thermal conductive device. ADVANTAGE - The film has 4 elongation at break, 8000-10000 S/cm electrical conductivity and 1600-1800 W/MK thermal conductivity, and can withstand more than 600 times repeated bending. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparation of low-fold thermal conductive graphene film comprising preparing more than 50 mu m average sized graphene oxide into 6-30 mg/mL graphene oxide aqueous solution, naturally drying, subjecting into film formation and reducing with reducing agent to obtain reduced graphene film; and heating obtained reduced graphene film at 200-400 degrees C under 0.1-5 degrees C/minute rate for 0.5-2 hours, heating again at 2400-3000 degrees C under 1-10 degrees C/minute rate and 5-60 MPa pressure for 0.5 hours in the presence of inert gas, naturally cooling, and pressing under 200-300 MPa pressure to obtain low-fold thermal conductive graphene film with 1.05:1 speed ratio of 2 roller systems.