▎ 摘　　要

NOVELTY - High precision thin film resistor device comprises a device layer and an isolation layer are arranged on a substrate. A multiple of isolation trenches, the each isolation trench is formed through the isolation layer and is internally provided with a heat conducting composite structure comprising a low dimensional nano-material with high thermal conductivity at the bottom of the isolation trench. A film resistor is located on the isolation layer. The thin-film resistor is arranged to overlap the isolation groove trench so that the heat-conducting composite structure and the thin-film resistor generate heat exchange thus conducting heat generated by thin film resistors to heat conducting composite structure. The two ends of thin film resistor are provided with contact electrodes. A radiating hole dissipates heat by forming heat conduction contact with the heat conducting composite structure. The low-dimensional nano-material comprises graphene, carbon nano-tube or molybdenum disulfide. USE - The high precision thin film resistor device is useful for analog integrated circuits, preferably active filter, R-type digital-to-analog converter, band-gap reference circuit and instrument amplifier. ADVANTAGE - The high precision thin film resistor device: can reduce precision and resolution of the conversion circuit caused by the reduction of the film resistance precision; has the heat conducting composite structure is provided with good thermal conductivity around the film resistor providing additional radiating hole, so that the working temperature is kept under the environment of low temperature drift thus inhibits the resistance of the thin film resistor drift in the continuous time of the large load; and sets the width direction consistent with the extending direction of the isolation trench. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparing high precision thin film resistor device.