▎ 摘　　要

NOVELTY - Preparing a cold/hot press molding of high-conductivity composite heat dissipation products, comprises taking 80-90 pts. wt. heat conduction material powder, 10-20 pts. wt. aqueous resin, 3-8 pts. wt. curing agent and 3-5 pts. wt. processing aid as raw materials, neutralizing aqueous resin with a neutralizing agent until the pH value is 7-8, adding deionized water to dilute the aqueous resin until the solid content is 10-20 wt.%, adding a curing agent and a processing aid, and uniformly stirring at normal temperature to obtain a resin mixture, mixing and granulating, pouring the heat-conducting material powder and resin mixture into an internal mixer for mixing at the temperature of 50-60℃, and performing calendering and crushing treatment after mixing to obtain composite heat-conducting particles, and pouring the resultant composite heat-conducting particles into a mold for hot-press molding or punch molding to obtain the final product. USE - The high-conductivity composite heat dissipation product is useful in electronic device. ADVANTAGE - The product: is suitable for the light and thin of the electronic product; has high thermal conductivity; can control the tablet thickness of the tablet machine to control; and ensure the development of high integration and function diversification. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a high-conductivity composite heat dissipation product prepared by the above mentioned method.