▎ 摘　　要

NOVELTY - The heat sink has a heat dissipation blade (200) whose first end (201) is the mounting end. A second end (202) is a free end, an inverse piezoelectric elastic sheet installed on the first end of the heat dissipation blade. The reverse piezoelectric elastic sheet vibrates under the action of electric current. The root of the first end of the heat dissipation blade and the root of the inverse piezoelectric elastic sheet are fixedly installed on a heat conducting block (100), so that the heat dissipation blade is driven by the inverse piezoelectric elastic sheet to vibrate. The heat dissipating blade is set with a laminated structure of an elastic thermal conductive metal sheet case and a graphene layer. USE - Heat sink for electronic device (claimed). ADVANTAGE - The heat dissipation device uses the reverse piezoelectric elastic sheet to drive the high-frequency vibration of the heat dissipation blades, improves the convective heat transfer coefficient to realize efficient heat dissipation, and the heat dissipation device does not include mechanical components such as bearings, so the service life is longer. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of the heat sink. Heat dissipation device (1) Heat conducting block (100) Heat dissipation blade (200) Ends (201,202)