▎ 摘　　要

NOVELTY - Resin film comprises a substrate layer A. The polyphenylene sulfide resin content in the substrate layer A is more than 60 wt.%, and the elongation at break of the resin film at 235℃ after 100 hours of heat treatment is more than 70%. USE - The resin film is useful for electronic, automobile, mechanical and chemical fields. ADVANTAGE - The resin film has high heat resistance, high thermal stability, high mechanical performance, and simple technique, is economical and more easily industrial production and use, and can retain mechanical property of the resin film after long-time high temperature heat treatment.