▎ 摘　　要

NOVELTY - Semiconductor assembly comprises: a substrate having a top surface and including a graphene layer below the top surface and configured to transfer thermal energy along a lateral direction across the substrate; a semiconductor device (212) over the top surface of the substrate; a thermal connector (234) between the substrate and the semiconductor device, where the thermal connector is configured to transfer the thermal energy from the semiconductor device to the graphene layer; and a heat spreader (222) over the top surface of the substrate and between opposing peripheral edges of the substrate, the heat spreader thermally coupled to the graphene layer. USE - Used as a semiconductor assembly. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a semiconductor module (204). DESCRIPTION OF DRAWING(S) - The figure shows a schematic cross-sectional view of the semiconductor device assembly. Semiconductor module (204) Component electrical connectors (208) Semiconductor device (212) Heat spreader (222) Thermal connector (234)