• 专利标题:   Graphene thermally-conductive CPU heat sink comprises heat radiating fan and heat radiating unit which includes heat radiating fin and heat conduction agent which is graphene heat conduction agent.
  • 专利号:   CN106125865-A
  • 发明人:   TAO Z
  • 专利权人:   TAICANG DOW ELECTRIC CO LTD
  • 国际专利分类:   C09D183/04, C09D007/12, G06F001/20
  • 专利详细信息:   CN106125865-A 16 Nov 2016 G06F-001/20 201703 Pages: 4 Chinese
  • 申请详细信息:   CN106125865-A CN10480238 28 Jun 2016
  • 优先权号:   CN10480238

▎ 摘  要

NOVELTY - A graphene thermally-conductive CPU heat sink comprises a heat radiating unit and a heat radiating fan. The heat radiating unit includes a heat radiating fin and a heat conduction agent. The heat conduction agent is a graphene heat conduction agent. USE - Graphene thermally-conductive CPU heat sink (claimed). ADVANTAGE - The CPU heat sink has compact structure and high cooling efficiency, adopts reasonable component proportioning, and has high thermal conductivity, excellent thermal cooling effect, rational use of filler dosage, low thermal impedance, excellent coating properties and paving performance, while ensuring the insulation properties of materials.