• 专利标题:   Multilayer-superposed graphene comprises graphene side of main body, where graphene main body is provided with PI high temperature glue, and one side of PI high-temperature glue provided with blue protective film.
  • 专利号:   CN216451696-U
  • 发明人:   CHENG X, QIN Z, LI G
  • 专利权人:   DONGGUAN HENGYI ELECTRONIC TECHNOLOGY CO
  • 国际专利分类:   H05K007/20
  • 专利详细信息:   CN216451696-U 06 May 2022 H05K-007/20 202241 Chinese
  • 申请详细信息:   CN216451696-U CN22228804 15 Sep 2021
  • 优先权号:   CN22228804

▎ 摘  要

NOVELTY - The utility model model claims a multi-layer overlapped graphene, relating to the technical field of graphene The utility model model comprises graphene main body, one graphene of the main body is provided with a PI high temperature glue, one side of the PI high temperature glue is provided with a blue protective film, the other side of the main body is graphene with a black insulating film, one side of the black insulating film is provided with a double faced adhesive tape, the double faced adhesive tape is uniformly distributed with a plurality of grids. The utility model through graphene main body can be overlapped with multiple layers, can help the main board radiating, at the same time has heat storage performance, more can protect electronic component electronic component, high temperature resistant PI high temperature glue for surface, which not only increases the performance and can protect the practicability of the graphite.