• 专利标题:   Preparing high thermal conductivity thermoplastic powder coating with uniform particle size distribution involves grinding the soluble salt first, adding thermoplastic polymer and graphene microchips into the high-speed mixer to disperse.
  • 专利号:   CN111073400-A
  • 发明人:   ZENG J, CHEN Q, ZHANG J, LIU C, HE F
  • 专利权人:   CHENGDU NEW KELI CHEM ENG SCI TECHNIC
  • 国际专利分类:   C09D123/06, C09D123/12, C09D127/06, C09D177/00, C09D005/03, C09D007/61
  • 专利详细信息:   CN111073400-A 28 Apr 2020 C09D-123/06 202042 Pages: 11 Chinese
  • 申请详细信息:   CN111073400-A CN10064294 20 Jan 2020
  • 优先权号:   CN10064294

▎ 摘  要

NOVELTY - Preparing high thermal conductivity thermoplastic powder coating with uniform particle size distribution involves grinding the soluble salt first, adding the thermoplastic polymer and graphene microchips into the high-speed mixer to disperse, extruding and granulating through the screw extruder to obtain a composite thermoplastic polymer. The composite thermoplastic polymer prepared is pulverized using a jet mill, and then classified and sieved using a screen to obtain a fine polymer. The fine polymer prepared is washed, then dried by a spray dryer, and then passed through a 100 mesh screen to obtain a high thermal conductivity thermoplastic powder coating with uniform particle size distribution. USE - Method for preparing high thermal conductivity thermoplastic powder coating with uniform particle size distribution. ADVANTAGE - The method enables to prepare high thermal conductivity thermoplastic powder coating with uniform particle size distribution has heat conducting performance, and coating film more uniformly.