▎ 摘　　要

NOVELTY - Manufacture of heat-dissipating composite material involves (1) mixing an inorganic binder and a filler to prepare a mixture (m1), (2) mixing a heat conductive material with the mixture (m1) to prepare a mixture (m2), (3) heat-treating the mixture (m2) to prepare composite particles in which coating the heat conductive material on the surface of the filler by the inorganic coating layer and curing the inorganic binder, and (4) mixing the composite particles and a polymer material. USE - Manufacture of heat-dissipating composite material used for electronic device (claimed) e.g. head lamp of LED, CPU and main board of computer, display, cell phone battery, and electric vehicle. ADVANTAGE - The method is economical, and enables manufacture of heat-dissipating composite material even at short period of time with improved mechanical strength, thermal conductivity, electrical insulation property. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: (1) a matrix, which comprises the polymer material, and composite particles distributed in the matrix, in which the composite particles comprising a filler and the heat conductive material coated on the surface of the filler by the inorganic coating layer; and (2) an electronic device, which consists of a heat generation unit for generating heat, heat sink to dissipate heat, and the heat dissipation composite material arranged between the heat generation and the heat sink to transfer heat generated in the heat generation to the heat sink.