• 专利标题:   Method for depositing graphene on substrate for semiconductor device, involves heating substrate in chemical vapor deposition chamber and flowing carbon precursor into chamber.
  • 专利号:   WO2011156749-A2, US2011303899-A1, WO2011156749-A3, TW201211302-A
  • 发明人:   PADHI D, JANZEN J, SHAIKH S, KIM B, CHIN B, KIM B H
  • 专利权人:   APPLIED MATERIALS INC, APPLIED MATERIALS INC
  • 国际专利分类:   C23C016/26, H01L021/205, H01L021/336, H01L021/20, H01L029/16, C01B031/04
  • 专利详细信息:   WO2011156749-A2 15 Dec 2011 H01L-021/205 201201 Pages: 18 English
  • 申请详细信息:   WO2011156749-A2 WOUS040035 10 Jun 2011
  • 优先权号:   US353594P, US158186

▎ 摘  要

NOVELTY - A substrate is placed in a chemical vapor deposition chamber and heated to less than 600 degrees C. A carbon precursor is flown into the chamber in order to deposit graphene on the substrate. The graphene precursor contains acetylene. An underlayer comprising cobalt or nickel is further deposited on the substrate before heating. USE - Method for depositing graphene on substrate for semiconductor device (claimed). ADVANTAGE - The graphene has low and stable resistivity at small line width, and can be deposited at low temperature. DESCRIPTION OF DRAWING(S) - The drawing shows the cross-sectional view of the field effect transistor. Source (205) Gate (210) Drain (215) Graphene connect (220) High resistivity silicon (250)