• 专利标题:   System used for manufacturing cured system used as thermal interface material for substrates e.g. printed circuit board and chip, comprises metallic nanoparticles or aromatic carbon-based material, polyfunctional surfactant capable of forming polymer, when reacted, and reactive additive.
  • 专利号:   WO2022216754-A1
  • 发明人:   LUND B R, BATCHELOR B
  • 专利权人:   ADAPTIVE 3D TECHNOLOGIES LLC, LUND B R, BATCHELOR B
  • 国际专利分类:   B82Y030/00, C08F002/44, C08G018/08
  • 专利详细信息:   WO2022216754-A1 13 Oct 2022 B82Y-030/00 202290 Pages: 26 English
  • 申请详细信息:   WO2022216754-A1 WOUS023553 05 Apr 2022
  • 优先权号:   US171015P

▎ 摘  要

NOVELTY - A system (100) comprises metallic nanoparticles or an aromatic carbon-based material, a polyfunctional surfactant (102), and a reactive additive. The polyfunctional surfactant is capable of forming a polymer, when reacted with the polyfunctional surfactant. USE - System is used for manufacturing cured system (all claimed) used as thermal interface material for substrates e.g. printed circuit board, die, and chip used in microelectronics. ADVANTAGE - The system enables efficient formation of thermal interface material having domains enriched with high-thermal conductivity fillers. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: cured system, which comprises the metallic nanoparticles or the aromatic carbon-based material, the polyfunctional surfactant, and a crosslinked polymer network, and has domains enriched with the metallic nanoparticles or the aromatic carbon-based material and domains enriched with the crosslinked polymer network. The polyfunctional surfactant is covalently bonded with the crosslinked polymer network; and manufacture of the cured system, which involves applying a magnetic field to the magnetic metallic nanoparticles in the system for forming domains enriched with the metallic nanoparticles and domains enriched with the crosslinked polymer network. DESCRIPTION OF DRAWING(S) - The drawing shows the schematic view of thermally conductive filler associated with polyfunctional surfactant. 100System 101Thermally conductive filler 102Polyfunctional surfactant