▎ 摘　　要

NOVELTY - Integrated chip comprises a substrate (102), a first conductive component above the substrate and a second conductive component, the upper portion of the substrate and transversely adjacent to the first conductive component where a concave hole (118) transversely separating the first conductive component and the second conductive component and the first conductive component and the second conductive component comprises graphene and one or more metals. USE - Integrated chip for a semiconductor device i.e. back-end-of-the-line (BEOL) device, of a metal interconnection layer. ADVANTAGE - The integrated chip is provided with a top surface, which is coplanar with the top surface of the first conductive component and the second conductive components, and hence enhances the reliability of the integrated chip, and reduces the manufacturing cost of integrated chip. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of the integrated chip where a guide hole is disposed above the second line, and a barrier layer is vertically between the second line and the guide hole. 102Substrate 104Multiple semiconductor devices 118Concave hole 118aFirst concave hole 120Circuit 126Dielectric liner 126aFirst dielectric underlayer 128Dielectric cover 128aFirst dielectric cover 130Etch stop layer 130aLayer 130bLayer 132Intermetallic dielectric layer 138Barrier layer 140Pad layer 142Guide hole 144Metal circuit 300Cross-sectional views