▎ 摘　　要

NOVELTY - Conductive paste comprises 9.6-30 wt.% organic solvent, and modified epoxy resin. The mass ratio of the modified epoxy resin to the organic solvent is 5-15:9.6-30 and the viscosity of the modified epoxy resin at 25℃ is 10000-30000cps. USE - The conductive paste is useful for coating or conductive circuit used in microelectronic package and flexible circuit board manufacturing. ADVANTAGE - The paste has good conductivity, good flexibility, tensile resistance and wear resistance, excellent adhesion to surface of the base material, good reliability, and can better satisfy the requirement of the flexible circuit board. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparation method of conductive paste.