• 专利标题:   PCB board, has temperature reducing material layer formed with multiple radiating through holes, where each radiating through hole is filled with nanometer heat-conducting graphene material and multiple radiating through holes are inclined.
  • 专利号:   CN209448963-U
  • 发明人:   LIU C, HU J
  • 专利权人:   DONGGUAN YOUSEN ELECTRONICS CO LTD, HUBEI BWIN TECHNOLOGY CO LTD
  • 国际专利分类:   H05K001/02
  • 专利详细信息:   CN209448963-U 27 Sep 2019 H05K-001/02 201978 Pages: 6 Chinese
  • 申请详细信息:   CN209448963-U CN21416627 29 Aug 2018
  • 优先权号:   CN21416627

▎ 摘  要

NOVELTY - The utility model claims a PCB plate technology field, especially relates to a kind of PCB plate has good radiating performance and high intensity, comprising a base material layer, a conductive layer arranged on the upper surface of the substrate layer, and an electronic component is disposed on the conductive layer, a plurality of radiating the second endothermic cooling material layer arranged on the lower surface of the base material layer of the first heat absorbing, temperature reducing material layer, which is set on the conductive layer and a through hole passing through the conductive layer, a base material layer and a first heat absorbing, temperature reducing material layer of the over-hole; the first heat absorbing, temperature reducing material layer is provided with a radiating through hole; the radiating through hole is filled with nanometer heat-conducting graphene material; the radiating through hole is inclined. because it is equipped with the first heat absorbing, temperature reducing material layer, a second heat absorbing, temperature reducing material layer and radiating through hole, and the first heat absorbing, temperature reducing material layer is provided with a radiating through hole, the radiating through hole is filled with nanometer heat-conducting graphene material, therefore, the PCB board can work fast in radiating, so the radiating effect is good, and the PCB plate has advantages of high intensity.