• 专利标题:   Preparing radiating micro-structure heat composite material useful in electronic device, comprises depositing high molecular aqueous solution into heat-conducting filler with filter film, freezing, cooling, drying, injecting thermosetting polymer, vacuumizing heating and curing.
  • 专利号:   CN115197454-A
  • 发明人:   HU R, FAN Y, YANG X, ZHOU S, XIE B, ZHANG X, LUO X
  • 专利权人:   UNIV HUAZHONG SCI TECHNOLOGY
  • 国际专利分类:   B01D029/05, B01D029/76, B01D029/80, B01D029/84, B29B015/12, C08J005/18, C08K003/04, C08K003/38, C08K007/06, C08K009/04, C08L001/28, C08L101/00, C08L023/06, C08L029/04, C08L039/06, C08L063/00, C08L075/04, C08L083/04
  • 专利详细信息:   CN115197454-A 18 Oct 2022 C08J-005/18 202204 Chinese
  • 申请详细信息:   CN115197454-A CN10867165 22 Jul 2022
  • 优先权号:   CN10867165

▎ 摘  要

NOVELTY - Preparing radiating micro-structure heat composite material comprises e.g. (i) mixing the heat conducting filler uniformly with the surfactant and deionized water to form the heat conducting filler dispersion; (ii) filtering the heat-conducting filler dispersion liquid, adding high molecular aqueous solution to fix the relative position, pumping away the deionized water and forming a heat-conducting filler deposition in a preset arrangement on the filter film; (iii) freezing and cooling the filter film and the heat-conducting filler deposition body on the filter film, so that the residual water is solidified into solid, freezing and drying continuously until the residual moisture in the deposition body is completely sublimed; and (iv) injecting the thermosetting polymer into the deposited body, vacuumizing repeatedly, so that the thermosetting polymer fills the gap of the deposition body, adding it into a high-temperature box for heating and curing. USE - The method is useful for preparing radiating micro-structure heat composite material is useful for thermal, mechanical, biochemical, food science and electronic device e.g. radar and laser. ADVANTAGE - The method enables to form a specific flow field in filtering and shaping space through design of a drainage plate so that the heat-conducting filler is deposited on an upper part of the filter film in preset arrangement shape thus realizes local orientation control of the heat conducting filler, and ensures that the prepared heat interface composite material is protected from being damaged and the hydrophilicity of the surfactant is adsorbed on the filler to ensure that the filler is fully dispersed in the deionized water to form dispersion liquid. DETAILED DESCRIPTION - Preparing radiating micro-structure heat composite material comprises (i) mixing the heat conducting filler uniformly with the surfactant and deionized water to form the heat conducting filler dispersion; (ii) filtering the heat-conducting filler dispersion liquid, adding high molecular aqueous solution into the heat-conducting filler after depositing the heat-conducting filler completely on the filter film to fix the relative position between the heat-conducting filler, pumping away the deionized water and forming a heat-conducting filler deposition in a preset arrangement on the filter film; (iii) freezing and cooling the filter film and the heat-conducting filler deposition body on the filter film, so that the residual water is solidified into solid, freezing and drying continuously until the residual moisture in the deposition body is completely sublimed; and (iv) injecting the thermosetting polymer into the deposited body, vacuumizing repeatedly, so that the thermosetting polymer fills the gap of the deposition body, adding it into a high-temperature box for heating and curing. INDEPENDENT CLAIMS are also included for: Filtering device comprises a drainage plate is set above the filtering film, and the filtering film, pumping and filtering bottle upper flask together form a filtering and shaping space, the drainage plate is provided with a through hole, the heat conducting filler passes through the through hole and is deposited on the filter film, where the position and size of the through hole are set according to the arrangement mode needed by the heat conducting filler; and Heat composite material, prepared as mentioned above.