▎ 摘　　要

NOVELTY - The method involves placing a substrate (1) in a vacuum coating machine, and respectively finishing the coating of an infrared anti-reflection film (2) on two surfaces of the substrate. The deionized water is used to carry out ultrasonic cleaning on the prepared sample, the sample is placed in a spin coater, photoresist is spin-coated on the surface of the sample, and the substrate coated with the photoresist is bakedin a spin mode by using a heating table. The ultraviolet exposure is carried outon the photoresist by using an ultraviolet photoetching machine, the pattern of the mask is copied to the surface of the obtained sample, and ultrasonic cleaning is carried out by using deionized water. The photoresist is removed on the surface of the sample by using an organic solvent after heating and baking, and ultrasonically cleaned by using deionized water to finally obtain the device compatible with the electromagnetic shielding infrared anti-reflection film. USE - Method for preparing compatible electromagnetic shielding infrared anti-reflection film device. ADVANTAGE - The method enables realizing double function of infrared reflection and electromagnetic shielding on a single device, thus solving the problem that the existing infrared window compatible electromagnetic shielding function is not good. The thin film device keeps the high transmittance of the infrared anti-reflection film, and has good electromagnetic shielding performance. The research result can be widely applied to the surface of various equipment windows and lays the technical foundation for the application of the new multifunctional composite film. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic diagram of electromagnetic shielding compatible infrared antireflection film device. Substrate (1) Infrared anti-reflection film (2) Graphene grid (3)