• 专利标题:   Structure e.g. microelectronic interconnect structures for hybrid graphene-metal lines, has secondary level with secondary level metal and via that electrically connects third metal to secondary level metal in vertical orientation.
  • 专利号:   US2014346674-A1, US9431346-B2
  • 发明人:   BAO J, BONILLA G, CHOI S S, FILIPPI R G, KIM A T, LUSTIG N E, SIMON A H
  • 专利权人:   INT BUSINESS MACHINES CORP, GLOBALFOUNDRIES INC
  • 国际专利分类:   H01L021/768, H01L023/528, H01L023/532, B82Y030/00, B82Y040/00, H01L021/44, H01L021/47, H01L023/525
  • 专利详细信息:   US2014346674-A1 27 Nov 2014 H01L-023/532 201480 English
  • 申请详细信息:   US2014346674-A1 US454765 08 Aug 2014
  • 优先权号:   US873356, US454765

▎ 摘  要

NOVELTY - The structure (100) has primary level comprising a first metal, a second metal and a third metal abutting and electrically connected in sequence with one another. The second metal has graphene. A secondary level is above the primary level. The secondary level comprise a secondary level metal and a via. The via electrically connects the third metal to the secondary level metal in a vertical orientation. The third metal comprises a length less than or equal to a critical length below which the third metal does not fail by electro migration. USE - Structure e.g. microelectronic interconnect structures for hybrid graphene-metal lines. ADVANTAGE - The advantages of the hybrid graphene metallization scheme is exploited to produce an electronic fuse (e-fuse) having improved characteristics such as improved programming reliability, lower programming currents and shorter programming times. The failure mechanism of the e-fuse structure is improved by lowering the programming current and reducing the programming times. The reliability and efficiency of the e-fuse structure is effectively improved. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method of forming hybrid grapheme-metal lines as unit of a back-end-of-the-line (BEOL) interconnect level. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view illustrating filling the secondary level line trench with graphene. Interconnect structure (100) Dielectric (110) Capping layer (130) Dielectric layer (210) Graphene line (270)