• 专利标题:   Flat heat pipe for use in heat dissipation of high power electronic device, has graphene interconnection array arranged in silicon carbide closed flat shell and for vertically growing with microporous structure of upper and lower inner surface of contact carbide close flat shell.
  • 专利号:   CN113624050-A
  • 发明人:   ZHANG Y, ZHAO Q
  • 专利权人:   UNIV CHINA ELECTRONIC SCI TECHNOLOGY
  • 国际专利分类:   F28D015/04
  • 专利详细信息:   CN113624050-A 09 Nov 2021 F28D-015/04 202234 Chinese
  • 申请详细信息:   CN113624050-A CN10953124 18 Aug 2021
  • 优先权号:   CN10953124

▎ 摘  要

NOVELTY - The pipe has a graphene interconnection array arranged in a silicon carbide closed flat shell and vertically grows with a microporous structure of an upper and lower inner surface of a contact carbide close flat shell, where thickness of the silicon carbide sealed flat plate shell is measured about 0.5mm1mm. The silicon carbide closed flat shell is provided with a radiating working medium, where single crystal silicon carbide is made into a sealed flat shell. A hollow structure is formed by bonding two silicon carbide sheets with grooves in symmetrical mirror surfaces. A vertical growing graphene is formed as a single-layer single crystal structure. USE - Flat heat pipe for use in heat dissipation of a high power electronic device. ADVANTAGE - The pipe provides high-efficiency and high-reliability flat heat pipe with better uniform heat effect, high heat conductivity and better structure heat stability. The pipe quickly absorbs large amount of heat through phase change process after completing local heating, and quickly and uniformly heat along a pipe surface so as to reduce temperature of a local hot spot, avoid the heating element caused by local temperature and structure collapse, and mass transfer to a side of the pipe under action of pressure gradient when heat absorbs and combines with a pipe outer heat sink to realize fast heat dissipation. DESCRIPTION OF DRAWING(S) - The drawing shows a structure schematic diagram of a flat heat pipe.