▎ 摘　　要

NOVELTY - The device has a composite plating layer (20) formed on base material (10), where the composite plating layer includes metal (22) and graphene particles (21) dispersed in the metal. The graphene particles comprising a portion are exposed or projected from a surface of the metal. The metal is made of nickel-phosphorus alloy. The graphene particles are provided as graphene-oxide particles. The base material is attached to a heat generator i.e. semiconductor device. USE - Heat transfer device e.g. heat spreader and heat pipe, for use in a CPU during heating operation. ADVANTAGE - The semiconductor device generates heat in a rapid manner such that the heat is transmitted through the base material to the surface of the composite plating layer. The device uses single-layer graphene to improve dispersion characteristics in the metal. The composite plating layer to exhibit satisfactory heat radiating capacity. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a method for making a heat transfer device. DESCRIPTION OF DRAWING(S) - The drawing shows a partial cross-sectional view of a heat transfer device. Base material (10) Composite plating layer (20) Graphene particles (21) Metal (22)