▎ 摘　　要

NOVELTY - Transferring high-resolution patterned conductive material comprises selecting the first substrate based on predetermined material characteristics, and selecting the conductive material based on predetermined material characteristics including an estimated first work of adhesion at first interface between the first substrate and the conductive material. The target polymeric film is selected based on predetermined material characteristics including an estimated second work of adhesion at a second interface between the conductive material and the target polymeric film. The estimated second work of adhesion is greater than the estimated first work of adhesion. A polymeric solution is prepared that turns into the target polymeric film when dried in ambient conditions. The conductive material is formed into the high-resolution patterned conductive material on the first substrate. USE - Method for transferring high-resolution patterned conductive material formed on a first substrate to a target polymeric film. ADVANTAGE - The method provides an economical, efficient, and effective formation of the high-resolution pattern of conductive material on a variety of films by polymer casting, allows quite small-scale patterns with sufficient resolution for such things as effective microelectronics without complex systems or steps and with substantial control over the characteristics of the film. The end product includes flexible, stretchable, porous, biodegradable, and/or biocompatible, which allows highly beneficial options in the design of high-resolution conductive patterns for a wide variety of applications. DETAILED DESCRIPTION - Transferring high-resolution patterned conductive material comprises selecting the first substrate based on predetermined material characteristics, and selecting the conductive material based on predetermined material characteristics including an estimated first work of adhesion at first interface between the first substrate and the conductive material. The target polymeric film is selected based on predetermined material characteristics including an estimated second work of adhesion at a second interface between the conductive material and the target polymeric film. The estimated second work of adhesion is greater than the estimated first work of adhesion. A polymeric solution is prepared that turns into the target polymeric film when dried in ambient conditions. The conductive material is formed into the high-resolution patterned conductive material on the first substrate. The target polymeric solution is directly covered over the first substrate and the high-resolution patterned conductive material to cover and contact the patterned conductive material. The directly covering target polymeric solution is formed into the target polymeric film by drying under ambient conditions. An INDEPENDENT CLAIM is included for a system for fabricating high-resolution conductive patterns on polymeric substrates, which comprises a subsystem for forming a high-resolution pattern with 3D features on a starting substrate, and a subsystem for forming a product comprising a combination of a high-resolution conductive pattern based on the high-resolution pattern on a polymeric substrate.