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  • 专利标题:   Silicone resin composition used for composite material for heat conductive silicone sheet for electronic component, comprises silicone resin and heat resistance improving agent comprising organic polycyclic aromatic compound containing secondary amino groups and ketone groups in cyclic structure.
  • 专利号:   WO2021161580-A1, JP6935162-B1, TW202130737-A, CN113661215-A, EP3929240-A1, US2021403717-A1, JP2021517069-X, EP3929240-A4
  • 发明人:   MAKOTO I, KATSUYUKI S, YUJI N, IWAI M, SUZUMURA K, NAKAJIMA Y, NAKASHIMA Y
  • 专利权人:   FUJI POLYMER IND CO LTD, FUJI KOBUNSHI KOGYO KK, FUJI POLYMER IND CO LTD, FUJI POLYMER IND CO LTD
  • 国际专利分类:   C08K005/34, C08L083/04, C08K003/013, C08K005/3447, C08K005/3465, C08K007/22, C08K009/06, C09K005/14, C08K003/22, C08K005/3437, C08L083/05, C08L083/07, H01L023/373, H05K007/20, C08K005/3415, C08K005/3432, C08K005/5435, C08K007/18, C08K005/3417
  • 专利详细信息:   WO2021161580-A1 19 Aug 2021 202172 Pages: 33 Japanese
  • 申请详细信息:   WO2021161580-A1 WOJP037637 02 Oct 2020
  • 优先权号:   JP022569, WOJP037637, CN80027548

▎ 摘　　要

NOVELTY - A heat-resistant silicone resin composition comprises a silicone resin and a heat resistance improving agent comprising an organic polycyclic aromatic compound containing secondary amino groups and ketone groups in a cyclic structure. USE - Silicone resin composition used for forming composite material for heat conductive silicone sheet (all claimed) for electronic and electrical component for semiconductor. Can also be used as sealing agent, heat insulating material, and electromagnetic wave absorber. ADVANTAGE - The silicone resin composition having excellent hear resistance and do not harden even at high temperature. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a silicone resin composite material, which comprises the composition comprising at least one filler chosen from inorganic filler and organic filler.