▎ 摘　　要

NOVELTY - The packaging structure (110a) has a circuit board (110a) comprising circuit layers and a composite material layer (112a), where the thermal conductivity of the composite material layer is between 450-700 W/mK. A heating element (130a) arranged on the circuit board and is electrically connected to the multilayer circuit layer. The heat generated by the heating element is transferred to the outside through the composite material layer. The composite material layer comprises a first material and a second material. The thermal conductivity of the first material is greater than a thermal conductivity of the second material. The first material is graphene and the second material is copper. USE - Packaging structure. ADVANTAGE - The packaging structure conducts the heat generated by the heating element to the outside in the horizontal direction through the composite material layer with the thermal conductivity larger than that of copper (400 W/mK), thus not only conducting the heat more quickly, but also having better heat dissipation efficiency. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a manufacturing method of the packaging structure. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic views of a method for fabricating a packaging structure. Packaging structure (100a) Circuit board (110a) Composite material layer (112a) First line layer (114d1) Second line layer (114d2) Opening (115a) Heating element (130a) Active surface (131) First electrode (132a1) Second electrode (132a2)