• 专利标题:   Radiating assembly for chip, controller and working machine, has radiating pipe structure connected with upper cover through solder paste layer, where one side of heat-conducting buffer piece far away from chip is tightly contact.
  • 专利号:   CN218217969-U
  • 发明人:   PAN J, SUN Y, YUAN A
  • 专利权人:   SHANGHAI HUAXING DIGITAL TECHNOLOGY CO
  • 国际专利分类:   F16F015/08, H01B017/56, H05K005/02, H05K005/03, H05K005/06, H05K007/20
  • 专利详细信息:   CN218217969-U 03 Jan 2023 H05K-005/02 202305 Chinese
  • 申请详细信息:   CN218217969-U CN22305915 31 Aug 2022
  • 优先权号:   CN22305915

▎ 摘  要

NOVELTY - The utility model relates to the technical field of radiating device, providing a radiating assembly for chip, a controller and a working machine, wherein the chip is located in the cavity surrounded by the upper cover and the lower cover, the radiating assembly for chip comprises a heat conducting buffer piece, a radiating pipe structure and graphene coating, a heat conducting buffer piece, set on one side of the chip; a radiating pipe structure, one side of the heat-conducting buffer piece far away from the chip is tightly contact and the radiating pipe structure is connected with the upper cover through the solder paste layer. The utility model claims a radiating assembly for chip, a controller and a working machine, the radiating pipe structure and the upper cover are fixedly connected by the solder paste layer, the heat conducting capability between the radiating pipe structure and the metal shell is reinforced; In addition, the outer surface of the upper cover is provided with graphene coating, which can improve the heat radiation capability of the product. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for: (1) a controller; (2) a working machine.