▎ 摘　　要

NOVELTY - Condensed two-component organic silicon pouring sealant comprises component A including 12-15 pts. wt. alpha,omega-dihydroxy polydimethylsiloxane, 1.5-2.5 pts. wt. plasticizer, 3-6 pts. wt. thermally conductive filler, and 6-10 pts. wt. base material as component B including 1.3-1.8 pts. wt. crosslinking agent, 0.5-1.5 pts. wt. coupling agent, 0.05-0.5 pts. wt. catalyst, and 1.8-2.2 pts. wt. plasticizer, where the base material includes 4-6 pts. wt. alpha,omega-dihydroxy polydimethylsiloxane, 1-2 pts. wt. carbon nanotube fiber and 1-2 pts. wt. silicon carbide whiskers, and the thermally conductive filler includes 1-2 pts. wt. zirconia, 1-2 pts. wt. graphene and 1-2 pts. wt. boron nitride. USE - Used as condensed two-component organic silicon pouring sealant. ADVANTAGE - The silicon pouring sealant has good thermal conductivity, high mechanical strength, and high adhesion strength to polyolefin electronic components. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a method for preparing condensed two-component organic silicon pouring sealant comprising (i) combining alpha,omega-dihydroxy polydimethylsiloxane, plasticizer, thermal conductive filler and base material at 80-120degrees Celsius and a vacuum degree of 0.06-0.1 MPa, kneading for 0.5-1 hours, cooling to room temperature, and discharging to obtain component A, (ii) mixing the cross-linking agent, coupling agent, catalyst, and plasticizer, stirring in vacuum, mixing well, discharging the material, aging for 20-24 hours, and filtering out the precipitate to obtain component B, and (iii) uniformly mixing the component A and the component B according to the mass ratio of 3-5:1.