• 专利标题:   Heat dissipation structure for use in electronic device, has heat dissipation module placed on surface of carrier, and including covering heating element, where setting position of module corresponds to heating element.
  • 专利号:   TW774360-B1, TW202245580-A
  • 发明人:   HE M, HUANG H, HUANG C
  • 专利权人:   CTRON ADVANCED MATERIAL CO LTD
  • 国际专利分类:   C01B032/182, C01B032/20, H01L023/373, H05K007/20
  • 专利详细信息:   TW774360-B1 11 Aug 2022 H05K-007/20 202291 Pages: 23 Chinese
  • 申请详细信息:   TW774360-B1 TW116651 07 May 2021
  • 优先权号:   TW116651

▎ 摘  要

NOVELTY - The present invention discloses a heat dissipation structure and an electronic device. The heat dissipation structure is in contact with a heat source. The heat source includes a heat generating element disposed on a first surface of a carrier. The heat dissipation structure includes a first heat dissipation module. The first heat dissipation module is disposed on the first surface of the carrier and covers the heat generating element. Wherein, the material of the first heat dissipation module includes the graphite material and/or graphene material, mixed with the ceramic material in a first adhesive material. The heat dissipation structure and the electronic device of the present invention can have excellent heat dissipation performance.