▎ 摘　　要

NOVELTY - The present invention discloses a heat dissipation structure and an electronic device. The heat dissipation structure is in contact with a heat source. The heat source includes a heat generating element disposed on a first surface of a carrier. The heat dissipation structure includes a first heat dissipation module. The first heat dissipation module is disposed on the first surface of the carrier and covers the heat generating element. Wherein, the material of the first heat dissipation module includes the graphite material and/or graphene material, mixed with the ceramic material in a first adhesive material. The heat dissipation structure and the electronic device of the present invention can have excellent heat dissipation performance.