• 专利标题:   Flexible heat-dissipating adhesive film used for electronic device e.g. mobile phone, has thin film copper sheet that is formed on one surface of heat conducting glue layer, and heat conductive adhesive layer formed on other surface of copper sheet.
  • 专利号:   CN113873830-A
  • 发明人:   WANG L
  • 专利权人:   GUANGDONG ZAISHENG NEW MATERIAL TECHNOLO, SHANGHAI ZAISHENG NEW MATERIAL TECHNOLOG
  • 国际专利分类:   G09F009/30, H05K007/20
  • 专利详细信息:   CN113873830-A 31 Dec 2021 H05K-007/20 202214 Chinese
  • 申请详细信息:   CN113873830-A CN11073792 14 Sep 2021
  • 优先权号:   CN11073792

▎ 摘  要

NOVELTY - The adhesive film has a thermally conductive adhesive layer that is formed on one side of a thin-film copper sheet (110). A thermally conductive adhesive layer (120) is formed on the other side of the thin film copper sheet, the thickness of the thin film copper sheet is 0.3-3~mm. The thermally conductive adhesive layer is configured as a graphene layer (130) in which graphene and synthetic resin are mixed. USE - Flexible heat-dissipating adhesive film e.g. foldable curved heat-proof adhesive film used for electronic device such as foldable mobile phone and Xiaomi's MIX fold. ADVANTAGE - The heat is rapidly conducted in the horizontal direction along the surface, so that the overall thermal diffusion effect of the entire heat dissipation adhesive film is large and the thermal conductivity is good. DESCRIPTION OF DRAWING(S) - The drawing shows a layer composition diagram of the heat dissipation adhesive film. Thin film copper sheet (110) Thermally conductive adhesive layer (120) Graphene layer (130) Release film layer (140)