▎ 摘　　要

NOVELTY - Releasing a graphene layer from a substrate, comprises (a) forming a graphene layer on a surface of a first substrate, optionally, patterning the graphene layer, (b) forming a metal layer on a surface of the graphene layer and (c) applying a pulling force on the metal layer to detach the graphene layer from the first substrate. USE - The methods are useful for releasing a graphene layer from a substrate, and manufacturing a graphene wafer and a graphene device (all claimed). ADVANTAGE - The method provides economical and easy manufacture of a graphene wafer and a graphene device with high electron mobility. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for: (1) manufacturing a graphene wafer, comprising (a), optionally patterning the graphene layer, (b), (c) as above per se, (d) bonding, by intermolecular force, the released graphene layer onto a surface of a second substrate separate from the first substrate or onto a surface of a bonding layer formed on the surface of the second substrate, and (e) removing the metal layer; (2) a graphene wafer comprising a single layer structure of graphene or a multilayer structure of graphene bonded to a first substrate, where the single layer structure of graphene and the multilayer structure of graphene are released from a second substrate different from the first substrate; and (3) manufacturing a graphene device, comprising (a)-(e) as above per se, patterning the graphene layer and forming an electrode on a surface of the patterned graphene layer. DESCRIPTION OF DRAWING(S) - The figure shows a cross-sectional view of the graphene wafer. Silicon carbide substrate (101) Epitaxial graphene layer (111) Adhesive metal layer (120) Support body bonding layer (122) Support body. (124)