▎ 摘　　要

NOVELTY - A heat-conducting ultra-thin grid adhesive tape comprises 100-120 pts. wt. acrylic adhesive, 10-30 pts. wt. tackifier, 5-15 pts. wt. functionalauxiliary agents, 1-3 pts. wt. flattening agent, 1 to 3 pts. wt. dispersant, 0.5 to 0.3 pts. wt. cross-linking agent and 200-300 pts. wt. solvent. USE - The heat-conducting ultra-thin grid adhesive tape is used in consumer electronics products such as mobile phone, notebook computer, tablet computer and in bonding parts. ADVANTAGE - The adhesive tape having improved heat-conducting property, enables easy heating of the heat dissipation parts, locally. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for the preparation of heat-conducting ultrathin mesh adhesive tape which involves: 1) adding acrylic acid adhesive, tackifier and solvent into a container, followed by uniformly stirring, adding a functional auxiliary agent and a dispersing agent, uniformly stirring, adding a leveling agent and a crosslinking agent and uniformly stirring to form a colloid; 2) coating the prepared colloid on a release film (1), drying the colloid to form a surface adhesive layer (5), followed by attaching a base material (4) to the surface adhesive layer; 3) continuously coating the other side of the base material attached with the colloid prepared in step 1, and drying to form adhesive surface on the other side; 4) forming a three-dimensional grid organic silicon layer (2) on the surface of the adhesive tape formed in step 3, using an UV-cured flexographic printing equipment, and then attaching another release film; 5) tearing off the release film attached to the surface adhesive layer formed in the step 4, followed by forming a three-dimensional grid organic silicon layer on the surface adhesive layer (5) using UV-cured flexographic printing equipment, and then attaching the release film again. DESCRIPTION OF DRAWING(S) - The drawing shows structural view of adhesive tape. Release film (1) Air exhaust grid layer (2) Heat conducting colloid layer (3) Base material layer (4) Heat conducting colloid layer (5) Air exhaust grid layer (6) Release film (7)