▎ 摘　　要

NOVELTY - Laminate structure comprises a metal wiring layer formed on a substrate; a graphene layer formed on the metal wiring layer; a first encapsulant layer formed on the graphene layer, where the first encapsulant layer contains metal oxide, metal nitride and/or metal oxynitride; a second encapsulant layer formed on the first encapsulant layer, and contains metal oxide, metal nitride and/or metal oxynitride, where the boundary layer between the metal layer and the graphene layer includes carbon and in which a metal composite is formed. The metal wiring layer is copper, titanium, silver, copper, nickel, iron, platinum, gold, aluminum, chromium, magnesium, manganese, molybdenum, rhodium, tantalum, tungsten, germanium, vanadium and/or zirconium. USE - The laminate structure is useful for printed circuit board of electronic device, surface treatment of substrate (all claimed), rigid printed circuit boards (RPCBs), flexible printed circuit boards (FPCBs), and rigid printed circuit boards (RFPCBs), and various components e.g. semiconductor devices, capacitors, and resistors. ADVANTAGE - The laminate structure achieves nano-level surface treatment using an atomic layer deposition process to cope with the trend toward miniaturization and ultrathinization of printed circuit boards. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for method for surface treatment of substrate.