• 专利标题:   Photothermal adhesive used in pick and place operation of object, comprises crosslinked polymeric matrix formed by the random block copolymerization of: e.g. urethane acrylate polymeric material, and polymeric crosslinker material.
  • 专利号:   WO2023063886-A2, WO2023063886-A3
  • 发明人:   TAN M W M, LEE P S
  • 专利权人:   UNIV NANYANG TECHNOLOGICAL
  • 国际专利分类:   C09J000/00, C09J011/04, C09J011/06, C09J175/16, C09J007/25, C09J007/30
  • 专利详细信息:   WO2023063886-A2 20 Apr 2023 C09J-000/00 202334 Pages: 40 English
  • 申请详细信息:   WO2023063886-A2 WOSG050723 11 Oct 2022
  • 优先权号:   SG10011389

▎ 摘  要

NOVELTY - Photothermal adhesive comprises crosslinked polymeric matrix formed by the random block copolymerization of: urethane acrylate polymeric material that has at least two acrylate end group; polymeric or oligomeric crosslinker material having at least two acrylate end group; and photothermal agent, where the photothermal agent is dispersed within the crosslinked polymeric matrix. USE - The adhesive is useful in pick and place operation of object, where the object is in the micrometer or millimeter scale (claimed). ADVANTAGE - The adhesive provides photothermal agent, which is capable of absorbing light for heat generation to bring about adhesive release through thermal expansion, and/or ablation. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for: forming photothermal adhesive comprising providing mixture having urethane acrylate polymeric material that has acrylate end groups, and polymeric or oligomeric crosslinker material including acrylate end groups, photothermal agent, and radical initiator, and heating the mixture at temperature of 50-100° C for period of time to provide the photothermal adhesive; and picking and placing object comprising adhering object to be placed to film of photothermal adhesive, where the photothermal adhesive to form adhered object, and placing the adhered object at desired site and releasing the object from the film of photothermal adhesive by applying light from light source to the film by causing thermal expansion or ablation of the film to effect release of the adhered object, optionally micrometer or millimeter scale.