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  • 专利标题:   Epoxy-type copper-clad plate material useful for aluminum substrate, and copper clad laminate, comprises composite resin, accelerator, curing agent and tin dioxide/graphene.
  • 专利号:   CN113667196-A
  • 发明人:   ZHANG C
  • 专利权人:   JIANGMEN HONGRU ELECTRONIC TECHNOLOGY CO
  • 国际专利分类:   B32B015/06, B32B015/20, B32B025/16, C08K003/04, C08K003/22, C08L009/02
  • 专利详细信息:   CN113667196-A 19 Nov 2021 C08L-009/02 202237 Chinese
  • 申请详细信息:   CN113667196-A CN10857922 28 Jul 2021
  • 优先权号:   CN10857922

▎ 摘　　要

NOVELTY - Epoxy-type copper-clad plate material comprises composite resin, accelerator, curing agent and tin dioxide/graphene. USE - The material is useful for aluminum substrate, and copper clad laminate (claimed). ADVANTAGE - The epoxy-type copper-clad plate material improves heat conductivity coefficient, yield strength, Young modulus and impact strength. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for: (1) a method for preparing the epoxy-type copper-clad plate base material; and (2) a PCB board.