▎ 摘　　要

NOVELTY - The sink has a silicon carbide substrate whose upper surface is etched with multiple grooves at intervals, where the thickness of the silicon carbide substrate is 0.1 to 1 mm and the size range of the length and width is 5 to 100mm. The upper surface of the silicon carbide substrate is covered with graphene on an area outside the groove. The groove is filled with a solder for welding a semiconductor laser chip, where the width of the groove is 10 microns to 1 mm, and the depth range is ranged from 500nm to 5 microns a semiconductor laser chip, and the thickness of the solder is 500nm to 5 microns. USE - Heat sink for improving heat conduction efficiency of a semiconductor laser chip. ADVANTAGE - The heat sink improves heat conduction efficiency of semiconductor laser chip. The heat sink preparation method is simple, low processing cost, and avoids damage to the device and personnel. The heat sink can obviously improve radiating performance of the semiconductor laser chip. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a semiconductor laser chip heat conduction efficiency enhancing heat sink preparing method. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of a heat sink for improving heat conduction efficiency of a semiconductor laser chip.