▎ 摘　　要

NOVELTY - Heat dissipating interface material is prepared by reacting modified graphene, polydimethylsiloxane, paraformaldehyde and bisphenol A, where the modified graphene is modified by a graphene graft coupling agent. USE - Heat dissipating interface material for high-power outdoor lighting light-emitting diode lamps. ADVANTAGE - The heat dissipating interface material has good thermal conductivity, corrosion resistance and electrical insulation, and can be effectively applied to light-emitting diode lamp to improve heat dissipation In addition. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for preparing heat dissipating interface material, which involves: (A) dissolving 10 pts. wt. graphene in DMF under ultrasonic dispersion for 10 minutes; (B) adding 10 pts. wt. coupling agent with stirring in a water bath at 50 degrees C for 2 hours to obtain modified graphene; (C) weighing 60 pts. wt. polydimethylsiloxane, 10 pts. wt. paraformaldehyde, 20 pts. wt. bisphenol A, and 0.5-10 pts. wt. modified graphene in chloroform with stirring for 12 hours in a water bath at 80 degrees C; (D) washed with sodium carbonate and water; and (E) removing the solvent to obtain the heat-dissipating interface material.