• 专利标题:   Preparing polyimide/graphite oxide nanocomposite film comprises e.g. oxidizing graphite to obtain graphene oxide, preparing polyamide/graphene oxide complex solution, casting the complex solution on mold and performing thermal imidization.
  • 专利号:   CN103589152-A
  • 发明人:   TANG H, YANG X, MIN C, NIE P, SONG H, CHEN D, CENG M
  • 专利权人:   UNIV JIANGSU
  • 国际专利分类:   C08G073/10, C08K003/04, C08K009/00, C08L079/08
  • 专利详细信息:   CN103589152-A 19 Feb 2014 C08L-079/08 201432 Pages: 8 Chinese
  • 申请详细信息:   CN103589152-A CN10500611 21 Oct 2013
  • 优先权号:   CN10500611

▎ 摘  要

NOVELTY - Preparing polyimide/graphite oxide nanocomposite film comprises (i) oxidizing graphite by Hummers method to obtain graphene oxide; (ii) ultrasonic dispersing the graphene oxide in an organic solvent, deoxidizing and adding diamine monomer under nitrogen protection, stirring until it is completely dissolved in the suspension, adding dianhydride monomer, and stirring in ice bath to obtain polyamide/graphene oxide complex solution; and (iii) casting the complex solution on the mold, removing organic solvent, and carrying out thermal imidization. USE - The method is useful for preparing polyimide/graphite oxide nanocomposite film (claimed). ADVANTAGE - The nanocomposite film has good wear resistance property (claimed). DETAILED DESCRIPTION - Preparing polyimide/graphite oxide nanocomposite film comprises (i) oxidizing graphite by Hummers method to obtain graphene oxide; (ii) ultrasonic dispersing the graphene oxide in an organic solvent to obtain graphene oxide suspension, where each ml of graphene oxide suspension contains 1.3x 10-5-1.3x 10-4 g graphene oxide, deoxidizing and adding diamine monomer under nitrogen protection, stirring until it is completely dissolved in the suspension, adding dianhydride monomer with equal moles of diamine monomer in portionwise manner, stirring under ice bath condition for 1-6 hours to obtain polyamide/graphene oxide complex solution; and (iii) casting the resultant polyamic acid/graphene oxide complex solution on the mold, removing the organic solvent, and carrying out thermal imidization at a temperature gradient of 100-300 degrees C.