• 专利标题:   Resin plating method during manufacture of e.g. electronic equipment, involves forming graphene thin layer on resin substrate by applying expanded graphite dispersion to resin substrate and electroplating resin substrate.
  • 专利号:   EP2615194-A2, EP2615194-A3
  • 发明人:   BAE A H, SON S I, NAM J D, LEE J H, HWANG T S, OH J S
  • 专利权人:   SAMSUNG ELECTRONICS CO LTD, SAMSUNG ELECTRONICS CO LTD
  • 国际专利分类:   C23C018/16, C23C018/20, C23C018/31, C23C018/40, C25D005/10, C25D005/56
  • 专利详细信息:   EP2615194-A2 17 Jul 2013 C23C-018/20 201482 Pages: 12 English
  • 申请详细信息:   EP2615194-A2 EP162845 07 Apr 2011
  • 优先权号:   KR046626

▎ 摘  要

NOVELTY - A resin plating method involves forming a graphene thin layer on a resin substrate by applying expanded graphite dispersion to the resin substrate, and electroplating the resin substrate having the graphene thin layer. USE - Resin plating method during manufacture of electronic equipment and automobile components. ADVANTAGE - The resin plating method improves external appearance and reduced weight of electronic equipment and/or automobile components. DESCRIPTION OF DRAWING(S) - The drawing shows the schematic structure explaining the resin plating method.