▎ 摘　　要

NOVELTY - An electronic device (1) comprises: 1) a substrate (11); 2) a metal layer (20) on a partial region of the substrate; 3) a two-dimensional material layer (50) over the metal layer and an upper surface of the substrate; and an insertion layer (30) between the metal layer and the two-dimensional material layer. USE - As electronic device. ADVANTAGE - In the electronic device, the reaction between the two-dimensional material and contact metal, is suppressed, by forming the two-dimensional material layer in the structure in bottom contact with the metal layer, to reduce or minimize the Fermi level pinning effect which is also enabled by the formation of metal-two-dimensional material interface without chemical bonding, by transferring a two-dimensional material on patterned metal electrode. The presence of insertion layer between the metal layer and the two-dimensional material layer, a barrier is lowered by controlling the work function, and the contact resistance is further lowered by limiting and/or preventing oxidation of the metal layer, which is also enabled by depositing the insertion layer directly on a surface of the metal layer through in-situ deposition after deposition of the metal layer. In the electronic devices, contact resistance between two-dimensional material and metal is lowered. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for the manufacture of an electronic device, which involves: i) forming a metal layer on a partial region of substrate; ii) forming an insertion layer on the metal layer; and iii) forming a two-dimensional material layer over the metal layer and the upper surface of the substrate, by a transfer process. DESCRIPTION OF DRAWING(S) - The drawing shows schematic cross-sectional view of electronic device. 1Electronic device 11Substrate 20Metal layer 30Insertion layer 50Two-dimensional material layer