▎ 摘　　要

NOVELTY - A heat dissipation component comprises a substrate (15) comprising a metal, and a graphene composite material (90) covering a portion of or entire surface of the substrate. The graphene composite material comprises a multilayer graphene layer (70) in which two or more layers of graphene (71) are laminated, and an amorphous carbon wall portion (80) comprising an amorphous carbon, which is adhered to at least a portion of a side surface of the multilayer graphene layer in the circumferential direction. USE - Heat dissipation component is used for central processing unit of personal computer, radiator of automobile, and battery. ADVANTAGE - The component has excellent heat dissipation property while maintaining the degree of freedom in the shape of the substrate. The substrate has improved heat conductivity. The multilayer graphene layer has improved mechanical strength and gas barrier property. Oxidation of the substrate even in an environment where the operating temperature of a general heat sink or radiator is 160° C, is suppressed. DESCRIPTION OF DRAWING(S) - The drawing shows a sectional view of the heat dissipation component. 15Substrate 70Multilayer graphene layer 71Graphene 80Amorphous carbon wall portion 90Graphene composite material