• 专利标题:   Formation of graphene layer for semiconductor device, involves exposing substrate comprising conductive and dielectric materials to plasma to clean conductive material, and exposing substrate to another plasma to form graphene layer.
  • 专利号:   WO2023287554-A1, US2023017035-A1
  • 发明人:   MEBARKI B, CHUA T C, VALENCIA C W, LEE J J, TANG X, CHEN X
  • 专利权人:   APPLIED MATERIALS INC, APPLIED MATERIALS INC
  • 国际专利分类:   C23C016/02, C23C016/26, C23C016/511, H01L021/02, H01L021/285, H01L021/67, H01L021/768, C23C016/27, C23C016/52, C23C016/56
  • 专利详细信息:   WO2023287554-A1 19 Jan 2023 H01L-021/285 202317 Pages: 27 English
  • 申请详细信息:   WO2023287554-A1 WOUS034226 21 Jun 2022
  • 优先权号:   US222093P, US844181

▎ 摘  要

NOVELTY - Method for forming a graphene layer, involves exposing a substrate comprising one or more of a conductive material and a dielectric material to a first plasma to clean the conductive material, where the first plasma is formed from an argon-hydrogen containing gas, exposing the substrate to a second plasma to form a graphene layer on the substrate, where the second plasma comprises argon, hydrocarbon, and hydrogen radicals, and cooling the substrate to a temperature ≤ 100° C at a controlled rate. The second plasma is a microwave plasma. USE - The method is useful for forming a graphene layer as a replacement for metal barrier layers in semiconductor devices, and in flexible electronics, e.g. smart watch applications. ADVANTAGE - The method is capable of depositing or forming graphene layer with high quality and low cost. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a processing tool comprising a central transfer station comprising a robot configured to move a wafer, process stations, where each process station connected to the central transfer station and provides a processing region separated from processing regions of adjacent process stations, the process stations comprises a pre-cleaning chamber, a graphene deposition chamber, and a cooling chamber, and a controller connected to the central transfer station and the process stations, where the controller is configured to activate the robot to move the wafer between process stations, and to control a process occurring in each of the process stations.