▎ 摘　　要

NOVELTY - The apparatus has a substrate (101) having a graphene layer that comprises openings corresponding to substrate pads, and a die arranged over the substrate and having electrical connections. Each of the electrical connections is in contact with a corresponding one of the substrate pads. The substrate is a printed circuit board (PCB). The graphene layer is configured to convey thermal energy away from the die, and is electrically insulated from electrical connections, and comprises monolayers of graphene. The electrical connections comprise solder joints. The die is a dynamic RAM device. USE - Apparatus e.g. dual in-line memory module (DIMM) for performing thermal management. ADVANTAGE - The memory module comprises a memory device that is provided with greater capacities and faster performance, and thus reduces the amount of heat generated poses a challenge to memory module and package design, and also conveys heat away from the memory devices to heat radiating structures which can be cooled by forced air cooling. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of an apparatus for performing thermal management. Memory module (100) Substrate (101) (102) Edge connector (102) (103) Memory device (103) Registering clock driver (104)