▎ 摘　　要

NOVELTY - Heat-dissipating coating comprises 30-40 pts. wt. ketone-aldehyde resin, 15-25 pts. wt. epoxy resin, 10-17 pts. wt. acrylate, 2-4 pts. wt. triethanolamine, 3-6 pts. wt. pentaerythritol, 9-18 pts. wt. modified diatomaceous earth, 3-5 pts. wt. nano titanium dioxide, 2-3 pts. wt. stearic acid, 3-5 pts. wt. graphene oxide, 2-3 pts. wt. aluminum oxide, 1-4 pts. wt. foaming agent, and 2-4 pts. wt. dispersing agent. USE - Heat dissipation coating for electronic device casing. ADVANTAGE - The heat dissipation coating has good heat dissipation effect, light weight, improved production efficiency, reduced production cost and reduces the thermal efficiency of electronic product, which can greatly improve the precision and service life of electronic products. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for preparing heat-dissipating coating, which involves: (A) weighing ketone-aldehyde resin, epoxy resin, acrylate, triethanolamine, pentaerythritol, modified diatomaceous earth, nano titanium dioxide, stearic acid, graphene oxide, aluminum oxide, antifoaming agent, dispersing agent, and keeping it for future use; (B) mixing modified diatomaceous earth,nano titanium dioxide, graphene oxide and aluminum oxide, dissolving in deionized water, adding with dispersing agent, and dispersing in high-speed dispersing machine for 15-30 minutes to obtain a mixed slurry; (C) placing ketone-aldehyde resin, epoxy resin, acrylate, triethanolamine, pentaerythritol together in the reaction vessel, raising the temperature to 60-80 degrees C, adding stearic acid while stirring, and keeping it warm after standing for 20 minutes; and (D) adding antifoaming agent and mixing the mixture obtained to mixed slurry, controlling the temperature of material to 50-70 degrees C, stirring, and naturally cooling to a normal temperature to obtain heat dissipation coating.