▎ 摘　　要

NOVELTY - Circuit structure comprises substrate comprising polymer composition comprising electrically conductive filler distributed within polymer matrix. The polymer matrix comprises thermoplastic high performance polymer having deflection temperature under load of about 40degreesC or more as determined in accordance with ISO 75-2:2013 at load of 1.8 megapascal. The polymer composition exhibits dielectric constant of 4 and dissipation factor of 0.3, as determined at frequency of 2 gigahertz. The conductive elements are set on substrate. USE - Circuit structure. ADVANTAGE - The circuit structure improves mechanical properties and surface quality, achieves sufficient bonding, and enhances overall process productivity. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: 1. a method for forming circuit structure, which involves: a. molding substrate; b. forming pattern on surface of substrate; c. subjecting patterned surface to plating process to form conductive elements; 2. an antenna system, which comprises circuit structure, where conductive elements are antenna elements configured to transmit and receive radio frequency signals. DESCRIPTION OF DRAWING(S) - The drawing shows side elevation view of circuit structure. Co-planar waveguide antenna (400) Co-planar ground layers (402) Antenna element (404) Ground layer (406) Substrate (408)