• 专利标题:   Packaging structure used in field of high frequency and high speed, has insulating protective layer that is provided around connecting pad and having opening on substrate, and top surface of conductive portion is exposed in opening.
  • 专利号:   CN218632031-U
  • 发明人:   LIN Q, LIANG J, LIN G
  • 专利权人:   UNIMICRON TECHNOLOGY CORP
  • 国际专利分类:   H01L023/498
  • 专利详细信息:   CN218632031-U 14 Mar 2023 H01L-023/498 202324 Chinese
  • 申请详细信息:   CN218632031-U CN22415575 13 Sep 2022
  • 优先权号:   CN22415575

▎ 摘  要

NOVELTY - The utility model claims a packaging structure, comprising: a substrate; connecting pad, set on the substrate; a conductive part, set on the connecting pad and electrically connected to the substrate, the conductive part comprises: a first metal layer; and graphene composite layer, set on the first metal layer; and an insulating protective layer, the substrate surrounds the connecting pad and has an opening, and the top surface of the conductive part is exposed in the opening.