▎ 摘　　要

NOVELTY - High thermal conductivity, anti-settling pouring sealant, comprises 90-110 pts. wt. vinyl silicone oil, 5-15 pts. wt. dimethyl silicone oil, 150-170 pts. wt. modified filler, and 0.04-0.08 pts. wt. catalyst as component A, and 80-100 pts. wt. vinyl silicone oil, 5-15 pts. wt. dimethyl silicone oil, 130-190 pts. wt. modified filler, 5-15 pts. wt. hydrogen-containing silicone oil, 0.2-0.4 pts. wt. organic peroxide as component B. The weight ratio of component A and B is 1:(0.8-1.2). The modified filler is prepared by (a) preparing phospholipid solution, (b) adding inorganic heat-conducting filler to phospholipid solution, mixing, centrifuging, washing and filtering to remove filtrate, drying to obtain phospholipid-coated filler, (c) adding silane-modified graphene oxide to solvent, and ultrasonically dispersing to obtain silane-modified graphene oxide dispersion, and (d) mixing with phospholipid-coated filler, centrifuging, filtering, and drying. USE - The pouring sealant is useful in the protection of the electronic element. ADVANTAGE - The sealant has good thermal conductivity and good anti-settling performance, and improves the compatibility between the heat conducting filler and the siloxane, so after long-term storage, sealing glue does not happen layering phenomenon. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparing the pouring sealant comprising (i) adding catalyst to vinyl silicone oil, stirring and mixing, adding modified filler under the condition of 40-50℃, stirring and mixing, adding dimethyl silicone oil, stirring and mixing to obtain component A, (b) adding hydrogen-containing silicone oil to vinyl silicone oil, stirring and mixing, then adding dimethyl silicone oil, modified filler, organic peroxide, stirring and mixing under the condition of 40-50℃ to obtain component B, and (iii) mixing components A and B.