• 专利标题:   Copper (Cu)-plated graphene powder in the form of graphene flakes covered with layer of metallic Cu comprises Cu layer applied to graphene from multicomponent metallizing solution and graphene flakes activated with activating solution.
  • 专利号:   PL429718-A1
  • 发明人:   TRZASKA M, CIESLAK G
  • 专利权人:   SIEC BADAWCZA LUKASIEWICZINST INZYNIERI
  • 国际专利分类:   B22F001/00, C23C018/40
  • 专利详细信息:   PL429718-A1 02 Nov 2020 B22F-001/00 202097 Pages: 1
  • 申请详细信息:   PL429718-A1 PL429718 24 Apr 2019
  • 优先权号:   PL429718

▎ 摘  要

NOVELTY - A copper (Cu)-plated graphene powder in the form of graphene flakes covered with layer of metallic Cu and obtained by chemical metallization, comprises Cu layer applied to graphene from multicomponent metallizing solution containing 5-15 g copper(II) sulfate, 40-60 g/dm3 sodium-potassium tartrate, 5-15 g/dm3 sodium hydroxide, 5-15 cm3/dm3 formalin, at room temperature (20-25 degrees C), with graphene flakes, before being introduced into the metallizing solution, are activated with an activating solution containing 10 pts. ethyl alcohol and 1 ph. solution prepared from 1 parts palladium chloride (PdCl2), 50 p.p. water, 11.8 pts. hydrochloric acid (HCl), and 118.5 pts. ethanol (C2H5OH). USE - A copper-plated graphene powder in the form of graphene flakes covered with layer of metallic copper and obtained by chemical metallization.